HUF76609D3S |
RFQ for HUF76609D3S Required Field |
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| Technical/Catalog Information | HUF76609D3S |
| Vendor | Fairchild Semiconductor |
| Category | Discrete Semiconductor Products |
| Mounting Type | Surface Mount |
| FET Polarity | N-Channel |
| Drain to Source Voltage (Vdss) | 100V |
| Current - Continuous Drain (Id) @ 25° C | 10A |
| Rds On (Max) @ Id, Vgs | 160 mOhm @ 10A, 10V |
| Input Capacitance (Ciss) @ Vds | 425pF @ 25V |
| Power - Max | 49W |
| Packaging | Tube |
| Gate Charge (Qg) @ Vgs | 16nC @ 10V |
| Package / Case | DPak, SC-63, TO-252 (2 leads+tab) |
| FET Feature | Logic Level Gate |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | HUF76609D3S HUF76609D3S |
| Product | Manufacturers | Pack | D/C |
| HUF76609D3S | - | TO-252(DPAK) | `06+(pb-free) |
Features |
| • Ultra Low On-Resistance - rDS(ON) = 0.160Ω, VGS = 10V - rDS(ON) = 0.165Ω, VGS = 5V• Simulation Models - Temperature Compensated PSPICE® and SABER© Electrical Models - Spice and SABER© Thermal Impedance Models - www.Intersil.com• Peak Current vs Pulse Width Curve• UIS Rating Curve• Switching Time vs RGS Curves |
| Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . VDSS | 100 | V |
| Drain to Gate Voltage (RGS = 20kΩ) (Note 1) .. . . . . . . . . . . . VDGR | 100 | V |
| Gate to Source Voltage . . . . . . . . . . . . . . . . . . . VGS | ±16 | V |
| Drain Current | ||
| Continuous (TC = 25, VGS = 5V). . . . .. . . . . ID | 10 | A |
| Continuous (TC = 25, VGS = 10V) (Figure 2) . . . . . . . . . . . . ID | 10 | A |
| Continuous (TC= 100, VGS = 5V) . . . . . . . . . . . . . . . ID | 7 | A |
| Continuous (TC= 100, VGS = 4.5V) (Figure 2) . . . . . . . . . . . ID | 7 | A |
| Pulsed Drain Current . . . . . . . . . . . . . . . . . IDM | Figure 4 | |
| Pulsed Avalanche Rating . . . . . . . . . . . . . . . UIS | Figures 6, 14, 15 | |
| Power Dissipation . . . . . . .. . . . . . PD |
49 | W |
| Derate Above . . . . . . . . . . . . .25 | 0.327 | W/ |
| Operating and Storage Temperature . . . . . TJ, TSTG | -55 to 175 | |
| Maximum Temperature for Soldering | ||
| Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . TL | 300 | |
| Package Body for 10s, See Techbrief TB334. . . . . . . . Tpkg | 260 |
| Models | MFG | Pack |
| HUF40244BT | ||
| HUF6439S3S | ||
| HUF75229P3 | TO-220 | |
| HUF75305D3ST | ||
| HUF75307 | ||
| HUF75307D3 | TO-251(IPAK) | |
| HUF75307D38 | ||
| HUF75307D3S | TO-252 | |
| HUF75307D3ST | ||
| HUF75307D3ST136 | ||
| HUF75307P3 | TO-220 | |
| HUF75307S | ||
| HUF75307S3S | ||
| HUF75307T3 | ||
| HUF75307T3S136 | ||
| HUF75307T3ST | SOT-223 | |
| HUF75307T3ST136 | ||
| HUF75309D3 | TO-252 | |
| HUF75309D3S | ||
| HUF75309D3ST |
